Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 5925-01-261-7872
NSN 5895-01-370-5045
NSN
NSN 6130-01-006-7990
NSN 6105-01-355-1262
NSN 6620-01-197-7083
NSN 5990-01-575-3275
NSN 6220-00-152-7114
NSN 5930-00-093-5867
NSN 5998-01-020-7274
NSN 6135-01-412-0404
NSN 2925-00-881-0164
Last Updated: 01/11/2025